Heat Transfer Performance of a Novel Microchannel Embedded with Connected Grooves

Abstract To improve the heat transfer performance of microchannels, a novel microchannel embedded with connected grooves crossing two sidewalls and bottom surface (type A) was designed. A comparative study conducted regarding performances type microchannels on their (including types B C), or D) as well smooth rectangular E) via three-dimensional numerical simulation experimental validation (at Reynolds numbers from 118 to 430). Numerical results suggested that average Nusselt number A, B, C, D were 106, 73.4, 50.1, 12.6% higher than E microchannel, respectively. The smallest synergy angle β entropy generation N s,a determined for based field nondimensional analysis, which indicated exhibited best performance. flow analysis induced fluid along different temperature gradients, contributed enhanced